- Title
- Thermomigration in Pb-free flip chip solder joints
- Creators - without role
- Wei-Cheng JhuFan-Yi Ouyang - 國立清華大學原子科學院工程與系統科學系
- Publication Details
- AMD fusion 7th Annual Technical Forum & Exhibition s" AMD fusion 7th Annual Technical Forum & Exhibition
- Identifiers
- 9957775808506774
- Academic Unit
- Institute of Nuclear Engineering and Science, College of Nuclear Science, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Thermomigration in Pb-free flip chip solder joints
AMD fusion 7th Annual Technical Forum & Exhibition s" AMD fusion 7th Annual Technical Forum & Exhibition
2011
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