- Title
- Thermomigration in microbumps of three-dimensional integrated Circuit packaging
- Creators - without role
- Wei-Neng HsuWei-Cheng JhuFan-Yi Ouyang - 國立清華大學原子科學院工程與系統科學系
- Publication Details
- International microsystems, packaging, assembly and circuit technology conference (IMPACT) International microsystems, packaging, assembly and circuit technology conference (IMPACT)
- Identifiers
- 9957772473406774
- Academic Unit
- Institute of Nuclear Engineering and Science, College of Nuclear Science, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Thermomigration in microbumps of three-dimensional integrated Circuit packaging
International microsystems, packaging, assembly and circuit technology conference (IMPACT) International microsystems, packaging, assembly and circuit technology conference (IMPACT)
2013
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