- Title
- Thermomigration of Ag in Pb-free SnAg solder joints
- Creators - without role
- Mulaine ShihYu-Ping SuFan-Yi Ouyang - 國立清華大學原子科學院工程與系統科學系
- Publication Details
- International microsystems, packaging, assembly and circuit technology conference (IMPACT) International microsystems, packaging, assembly and circuit technology conference (IMPACT)
- Identifiers
- 9957775327106774
- Academic Unit
- Institute of Nuclear Engineering and Science, College of Nuclear Science, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
Conference paper
Thermomigration of Ag in Pb-free SnAg solder joints
International microsystems, packaging, assembly and circuit technology conference (IMPACT) International microsystems, packaging, assembly and circuit technology conference (IMPACT)
2013
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