Thermomigration of Sn in 96.5Sn-3Ag-0.5Cu flip chip solder joints

Conference paper

Fan-Yi Ouyang, Wei-Cheng Jhu, Yi-Shao Lai and C.-L. Kao

IUMRS-ICA 2011 12th International Conference in Asia IUMRS-ICA 2011 12th International Conference in Asia

2011

Abstract

Thermomigration

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Title: Thermomigration of Sn in 96.5Sn-3Ag-0.5Cu flip chip solder joints
Creators - without role: Fan-Yi Ouyang - 國立清華大學原子科學院工程與系統科學系
Wei-Cheng Jhu
Yi-Shao Lai
C.-L. Kao
Publication Details: IUMRS-ICA 2011 12th International Conference in Asia IUMRS-ICA 2011 12th International Conference in Asia
Identifiers: 9957767806506774
Academic Unit: Institute of Nuclear Engineering and Science, College of Nuclear Science, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper