Toward the micromachined vibrating gyroscope using (111) silicon wafer process

Jerwei Hsieh; Wen-Chih Chen; Weileun Fang

doi:10.1117/12.442961

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Conference paper

Toward the micromachined vibrating gyroscope using (111) silicon wafer process

Jerwei Hsieh, Wen-Chih Chen and Weileun Fang

Proceedings of SPIE - The International Society for Optical Engineering, Vol.4557, pp.40-48

2001

DOI: https://doi.org/10.1117/12.442961

Abstract

(111) silicon wafer

BELST process

Boron etching stop

Corner compensation

Gyroscope

RIE lag

The issues regarding structure design and fabrication in improving the performance of MVGs are discussed. Although using (111) Si wafer with existing HARM process is appropriate, some limitations on design and fabrication still exist. This study proposes a novel BELST process that can improve the device performance as well as fabrication capability of the existing techniques. The salient features of the process are described, and various design concepts have been demonstrated from the fabrication results. According to the result, MVGs with desired shape and thickness can easily be obtained using the developed BELST process.

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Title: Toward the micromachined vibrating gyroscope using (111) silicon wafer process
Creators - without role: Jerwei Hsieh - National Tsing Hua University
Wen-Chih Chen - Power Mechanical Engineering Dept. , National Tsing Hua University
Weileun Fang - National Tsing Hua University
Publication Details: Proceedings of SPIE - The International Society for Optical Engineering, Vol.4557, pp.40-48
Identifiers: 9957767078806774
Academic Unit: Institute of NanoEngineering and Microsystems, College of Engineering, National Tsing Hua University
Language: English
Resource Type: Conference paper

Toward the micromachined vibrating gyroscope using (111) silicon wafer process

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