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Trustworthy Lifetime Prediction by Aging History Analysis and Multi-Level Stress Test
Conference paper

Trustworthy Lifetime Prediction by Aging History Analysis and Multi-Level Stress Test

Chen-Lin Tsai and Shi-Yu Huang
Proceedings - 7th IEEE International Test Conference in Asia, ITC-Asia 2023
2023

Abstract

Accelerated Aging Model Built-In Speed Grading Lifetime Prediction Machine Learning Reliability Stress Test Hardware and Architecture Electrical and Electronic Engineering Safety Risk Reliability and Quality Control and Optimization
An IC used in a safety-critical application such as automotive often requires a long lifetime of more than 10 years. Previously, stress test has been used as a means to establish the accelerated aging model for an IC product under a harsh operating condition. Then, the accelerated aging model is time-stretched to predict an IC's normal lifetime. However, such a long-stretching prediction may not be very trustworthy. In this work, we present a more refined method to provide higher credibility in the IC lifetime prediction. We streamline in this paper a progressive lifetime prediction method with two phases - the training phase and the inference phase. During the training phase, we collect the aging histories of some training devices under various stress levels. During the inference phase, the extrapolation is performed on the 'stressed lifetime' versus the 'stress level' space and thereby leading to a more trustworthy prediction of the lifetime.

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