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Ultra-thin (AlCrTaTiZrRux)Ny Multi-component Films as Robust Diffusion Barrier Layers for Cu Interconnect Application
Conference paper

Ultra-thin (AlCrTaTiZrRux)Ny Multi-component Films as Robust Diffusion Barrier Layers for Cu Interconnect Application

Shou-Yi Chang, Chen-En Li, Sheng-Cheng Chiang, Chen-Yuan Wang, Dao-Sheng Chen and Ming-Ku Chen
Proceedings of International Union of Materials Research Societies – 12th International Conference in Asia Proceedings of International Union of Materials Research Societies – 12th International Conference in Asia (IUMRS-ICA 2011)
2011

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