Abstract
The TaN/HfON/GeO 2 /n-Ge pMOSFETs were fabricated with different formation processes of GeO 2 interfacial layer. Ultra low EOT of around 0.5 nm is achieved using GeO 2 grown by H 2 O plasma together with in-situ grown HfON gate dielectric, and simultaneously the peak hole mobility of Ge pMOSFET is 312 cm 2 /V*s. © 2013 IEEE.