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Vertical Integration of Force Transmission Structure on Capacitive Cmos-Mems Tactile Force Sensor for Sensitivity Improvement
Conference paper

Vertical Integration of Force Transmission Structure on Capacitive Cmos-Mems Tactile Force Sensor for Sensitivity Improvement

Yuanyuan Huang, Yen-Lin Chen, Shihwei Lin, Fuchi Shih, Zihsong Hu and Weileun Fang
Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Vol.2023-January, pp.791-794
2023

Abstract

Capacitive tactile force sensor CMOS-MEMS Force transmission structure Vertical integration Electronic Optical and Magnetic Materials Condensed Matter Physics Mechanical Engineering Electrical and Electronic Engineering
This study extends the capacitive tactile force sensor array to develop a novel force transmission structure for sensitivity enhancement (Fig. 1). The sensor is designed and implemented using the commercial TSMC 1P6M CMOS process. Merits of the proposed design include: (1) Pillar-array force transmission structure: integrate with capacitive sensing array vertically to effectively transmit the load to each sensing elements to enhance the sensitivity; (2) Rigid force contact interface (i.e. glass bump): can be employed to further enhance the sensitivity. Measurements show that the sensitivity of proposed design with rigid glass bump is 5.04 fF/N (sensing range:5N). Compare with reference design having the same bump size, the sensitivity is increased for 2-fold.

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