Abstract
The TaN/HfON/GeO2/n-Ge pMOSFETs with different formation processes of GeO2 interfacial layer are studied. A very low EOT of ~0.5 nm with a highly stoichiometric GeO2 interfacial layer is achieved by in-situ H2O plasma grown GeO2 together with ALD-formed HfON. The peak hole mobility of Ge pMOSFET is 312 cm2/V*s.