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Wafer level batch fabrication and assembly of small form factor optical pickup head
Conference paper

Wafer level batch fabrication and assembly of small form factor optical pickup head

Sheng-Yi Hsiao, Chih-Chun Lee, Yi Chiu, Hsi-Fu Shih, Jin-Chern Chiou, Han-Ping D. Shieh and Weileun Fang
2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS, pp.102-103
2008
DOI: https://doi.org/10.1109/OMEMS.2008.4607849

Abstract

Crystalline plane mirror Optical pickup head Small form factor Wafer level packaging
A MEMS batch assembly process for fabricating small form factor optical pickup head is proposed to minimize the complexity of assembly. Electrical and optical components are sealed in a chamber. A silicon optical bench with a packaged laser diode and crystalline-plane mirrors is demonstrated. © 2008 IEEE.

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