Abstract
This study has successfully demonstrated a process to localize assembly and weld microstructures using external magnetic field. The primary three merits of this technology: (1) The magnetic field is not only to assemble the microstructures but also to fix them by induction welding; (2) The assembly and welding can be localized by the magnetic film. However, a global wafer level process can be achieved by the magnetic field; (3) It is easy to tune the heating temperature by varying the area of magnetic film; in other words, the photolithography can define various temperature region on substrate. © 2005 IEEE.