- Title
- Warpage Induced Stress Effect on Microbump Assembly of 3D ICs Packages
- Creators - without role
- C. C. Lee - 國立清華大學工學院動力機械工程學系T. L. TzengC. S. WuT. F. YangT. H. Chen
- Identifiers
- 9957776086806774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Conference paper
- Publication Details
- Proceedings of the 29th National Conference on Mechanical Engineering (CSME) Proceedings of the 29th National Conference on Mechanical Engineering (CSME)
Conference paper
Warpage Induced Stress Effect on Microbump Assembly of 3D ICs Packages
Proceedings of the 29th National Conference on Mechanical Engineering (CSME) Proceedings of the 29th National Conference on Mechanical Engineering (CSME)
2012
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