- Title
- Warpage Reinforcement Designs of Fan-Out Heterogeneous Integrated Packaging
- Creators - without role
- 昌駿 李
- Identifiers
- 9957777331406774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- English
- Resource Type
- Conference paper
- Publication Details
- ASME International Mechanical Engineering Congress and Exposition
Conference paper
Warpage Reinforcement Designs of Fan-Out Heterogeneous Integrated Packaging
ASME International Mechanical Engineering Congress and Exposition
11/2020
Related links
Metrics
1 Record Views