Wettability of Electroless-Nickel Metallization and Lead Free Solder

Conference paper

B. L. Young, C. S. Huang and J. G. Duh

Taiwan Printed Circuit Association (TPCA) 2000 Forum Proceedings Taiwan Printed Circuit Association (TPCA) 2000 Forum Proceedings, pp.514-524

2000

Metrics

1 Record Views

Title: Wettability of Electroless-Nickel Metallization and Lead Free Solder
Creators - without role: B. L. Young
C. S. Huang
J. G. Duh - 國立清華大學工學院材料科學工程學系
Publication Details: Taiwan Printed Circuit Association (TPCA) 2000 Forum Proceedings Taiwan Printed Circuit Association (TPCA) 2000 Forum Proceedings, pp.514-524
Identifiers: 9957768265206774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper