Wetting Behavior and Interfacial Reaction between New Electrolytic Ni-Pd Surface Finish/Sn-3.0Ag-0.5Cu Solder Joints

Conference paper

C. Y. Ho and J. G. Duh

TMS 2012 141th Annual Meeting & Exhibition TMS 2012 141th Annual Meeting & Exhibition

2012

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Title: Wetting Behavior and Interfacial Reaction between New Electrolytic Ni-Pd Surface Finish/Sn-3.0Ag-0.5Cu Solder Joints
Creators - without role: C. Y. Ho
J. G. Duh - 國立清華大學工學院材料科學工程學系
Publication Details: TMS 2012 141th Annual Meeting & Exhibition TMS 2012 141th Annual Meeting & Exhibition
Identifiers: 9957769407206774
Academic Unit: National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper