Abstract
This research develops interaction models among companies in IC supply chain to study the information integration among them. The main processes of IC supply chain are IC design, wafer fabrication, wafer probe, IC packaging/ assembly, and final test. A workflow model between IC design houses and wafer fabrication plants is developed with focuses on purchase order, engineering data, and work-in-process status. This model facilitates the standardization and simplification for the information integration interfaces, which could increase the communication efficiency and effectiveness between customers and vendors. Finally, Extricity Alliance software is used in a case study to demonstrate the interaction process and information flow between IC design houses and wafer fabrication plants. © 2009 IEEE.