以濕潤天平量測Sn,Sn-Cu,與Sn-Pb之濕潤性

Conference paper

秀玉張, E. Viard, 柔儀李 and 信文陳

2001年中國材料學會年會論文摘要集 2001年中國材料學會年會論文摘要集, p.10

2001

Abstract

濕潤天平;Sn;Sn-Cu;Sn-Pb;濕潤性

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Title: 以濕潤天平量測Sn,Sn-Cu,與Sn-Pb之濕潤性
Translated title: Wetting study of Sn-Cu and Sn-Bi lead-free solders by a wetting balance
Creators - without role: 秀玉張
E. Viard
柔儀李
信文陳 - 國立清華大學工學院化學工程學系
Publication Details: 2001年中國材料學會年會論文摘要集 2001年中國材料學會年會論文摘要集, p.10
Identifiers: 9957776435106774
Academic Unit: Department of Chemical Engineering, College of Engineering, National Tsing Hua University
Language: Traditional Chinese
Resource Type: Conference paper