- Title
- 通電對Ag-Cu-Sb合金的微結構與Ni基材界面反應
- Creators
- R.-Z. Yang (Author)Sinn-Wen Chen - National Tsing Hua University, College of Semiconductor Research
- Conference
- 台灣化學工程學會72週年年會(2025 TwIChE) (國立成功大學National Cheng Kung University, 29/11/2025–30/11/2025)
- Resource Type
- Conference paper
Conference paper
通電對Ag-Cu-Sb合金的微結構與Ni基材界面反應
台灣化學工程學會72週年年會(2025 TwIChE) (國立成功大學National Cheng Kung University, 29/11/2025–30/11/2025)
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