摘要
This study extends the inductive coil force sensor design to develop a multifunctional tactile sensing hub that monolithically integrates a coil-array proximity sensor, a coil-array three-axis force sensor, and a heat-flux sensor using the TSMC 0.35 \mu ~\mathrm{m} 2P4M CMOS process. The device employs a planar coil array for both inductive force and fringe capacitive proximity sensing. The polymer-encapsulated Cr-steel ball serves as the contact interface, preventing signal drift caused by the surface roughness of contacting objects, while the polymer layer provides compliance and mechanical flexibility. Furthermore, the integrated heater and thermometer enable evaluation of the thermal conductivity of contacting objects through heat-flux response and provide temperature compensation for force sensing, thereby reducing sensitivity variation caused by the thermal expansion of the polymer layer. The proposed design enables multimodal tactile sensing within a compact CMOS-compatible structure.