摘要
This study employs finite element method (FEM) to derive equivalent material properties for advanced packaging components. While classical models such as the rule of mixtures (ROM) and inverse rule of mixtures (IROM) are adequate for simple patterns, they fail to capture complex routing geometries. The effective Young's modulus is found to be strongly pattern-dependent, whereas the coefficient of thermal expansion (CTE) shows limited sensitivity. By calibrating the Halpin-Tsai shape parameter against FEM results, a pattern-specific correction is developed, enabling accurate and efficient property estimation for complex substrate and interposer structures.