摘要
With the recent slowdown in transistor scaling, the semiconductor industry has been actively exploring new technological pathways to sustain performance improvements and cost efficiency. Among these, chiplet-based design has become a central focus, offering a promising route to extend system performance. However, as packaging designs grow increasingly complex and integration density rises, reliability challenges have also intensified.In this study, a 3D Finite Element Analysis (FEA) model is employed to effectively evaluate the reliability of chiplet packages. Due to the structural complexity and large element count of chiplet models, the Global-Local Finite Element Method (FEM) is integrated with the Equivalent Beam Theory to reduce the total number of elements and computational time. Coupled thermo-mechanical simulations are conducted in ANSYS APDL under JEDEC thermal cycling conditions (-40 °C to 125 °C) using SAC305 solder, in order to identify potential failure regions.Although the equivalent beam model effectively predicts failure locations, it still requires a long computation time due to the numerous Multi-Point Constraints (MPC) and convergence issues. Therefore, this study aims to enhance the computational efficiency of chiplet package reliability simulations by optimizing the equivalent beam model while maintaining prediction accuracy.