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Inductive Coupled Downstream Plasma CD Trim Process Stability Study
會議論文集

Inductive Coupled Downstream Plasma CD Trim Process Stability Study

Yali Fu, Shawming Ma, Yi Wang, Linda Sui, Lu Chen, Vijay Vaniapura, Li Diao, Mingjie Jiao 和 Hongwei Chen
2019 China Semiconductor Technology International Conference (CSTIC), 頁碼.1-3
03/2019
Web of Science ID: WOS:000490874500051

摘要

Ash CD trim chamber condition Costs downstream plasma Plasma temperature Plasmas stability Strips Substrates Temperature sensors Thermal stability Throughput
CD trim process is incline to run on strip tool because of the low cost and high throughput benefit. However, CD stability is the key challenge. In this article, PR descum process for CD trim was studied on the chamber with substrate temperature <300 °C. It is found that the CD was sensitive to the chamber condition which impacted by the mix-run and tool idle while normal strip process kept stable ash rate. The mechanism of the impact was studied and verified. The results from this study also provide guidance on how to get the good stability of CD trim process in downstream plasma chamber.

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詳細資料

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