PHYSICAL ANALYSIS OF GYROID STRUCTURES FOR THERMAL DISSIPATION IN ADVANCED PACKAGING ARCHITECTURE

Conference proceeding

Meng Hsuan Lee, Jui Chang Chuang and Chun Wei Liu

Proceedings of ASME 2025 International Mechanical Engineering Congress and Exposition, IMECE 2025, Vol.9, v009t14a016

2025

Abstract

Advanced Packaging

Finite Element Analysis (FEA)

Gyroid Structures

Thermal Dissipation

url

https://doi.org/10.1115/IMECE2025-165959View

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Title: PHYSICAL ANALYSIS OF GYROID STRUCTURES FOR THERMAL DISSIPATION IN ADVANCED PACKAGING ARCHITECTURE
Creators: Meng Hsuan Lee - National Taitung University
Jui Chang Chuang - National Tsing Hua University
Chun Wei Liu - National Tsing Hua University
Resource Type: Conference proceeding
Date published: 2025
Publication Details: Proceedings of ASME 2025 International Mechanical Engineering Congress and Exposition, IMECE 2025, Vol.9, v009t14a016
Language: English