摘要
This study reports a novel packaging technique using the polymer cover. The polymer cover with built-in flexible connectors is mechanically interlocked to Si-substrate with built-in socket arrays. These components are realized using microfabrication processes and further integrated with MEMS-device chip. The shapes of socket/connector are easily patterned using processes. The typical interlocking strength was ranging 1 MPa. Moreover, the hydrophobic characteristic of polymers provides the waterproof condition. In applications, the interlocking of SCREAM devices and polymer cover was demonstrated. This removable/reusable packaging technique can act as a temporary protection for suspended MEMS devices during dicing and handling. © 2007 IEEE.