Study of Plug Etch back process matching on faraday shielded ICP and traditional CCP plasma ETCH chambers

會議論文集

Yali Fu, Shawming Ma, Yi Wang, Jammy Xiao, M. H. Kim, Nancy Zhang, Mingjie Jiao, Frank Wang 和 Tammy Lee

China Semiconductor Technology International Conference 2018, CSTIC 2018, 頁碼.1-3

29/05/2018

摘要

CCP plasma

Faraday shield

ICP plasma

Ion energy control

O2 chemistry

Plug Etch Back

surface modification

1 檢視次數

題名: Study of Plug Etch back process matching on faraday shielded ICP and traditional CCP plasma ETCH chambers
創作者：: Yali Fu - Mattson Technology, China Field Process Group, Beijing, China
Shawming Ma - Mattson Technology, Plasma Product Group, Fremont, CA, United States
Yi Wang - Peking University
Jammy Xiao - SMNC ETCH Department, Beijing, China
M. H. Kim - Mattson Technology, Plasma Product Group, Fremont, CA, United States
Nancy Zhang - Mattson Technology, China Field Process Group, Beijing, China
Mingjie Jiao - Mattson Technology, China Field Process Group, Beijing, China
Frank Wang - Mattson Technology, Plasma Product Group, Fremont, CA, United States
Tammy Lee - Mattson Technology, Plasma Product Group, Fremont, CA, United States
總頁數: 3
學術資源類型: 會議論文集
出版日期: 29/05/2018
出版資訊: China Semiconductor Technology International Conference 2018, CSTIC 2018, 頁碼.1-3
語言: 英語