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Sub-60 mV/dec germanium nanowire field-effect transistors with 2-nm-thick Ferroelectric Hf0.5Zr0.5O2
會議論文集

Sub-60 mV/dec germanium nanowire field-effect transistors with 2-nm-thick Ferroelectric Hf0.5Zr0.5O2

Y.-W. Lin, T.-Y. Yu, C.-J. Su, Y.-N. Chen, H.-H. Chang, G.-L. Luo, C.-T. Wu, W.-F. Wu, K.-L. Lin, F.-J. Hou, …
VLSI-TSA 2021 - 2021 International Symposium on VLSI Technology, Systems and Applications, Proceedings
2021

摘要

Alumina Aluminum oxide Atomic layer deposition Ferroelectricity Germanium Hafnium compounds Nanowires Rapid thermal annealing Rapid thermal processing VLSI circuits Zirconium compounds Drain voltage Germanium nanowires Interfacial layer Low hysteresis Microwave annealing N-type Ge Rapid thermal annealing (RTA) Subthreshold slope Field effect transistors
We report an n-type Ge nanowire ferroelectric-Hf0.5Zr0.5O2 field effect transistor (Ge NW FE-HZO FET) was experimentally demonstrated. An in-situ ALD O3 treatment was carried out to form an atomically-thin (~0.4 nm) interfacial layer (IL) of GeOx, followed by a 2-nm FE-HZO capped with a 1-nm Al2O3 layer. It is found that microwave annealing (MWA) sample shows better uniformity of FE-HZO properties compared to rapid thermal annealing (RTA). The fabricated Ge NW FE-HZO FET shows minimum subthreshold slope (SSmin) of 55 mV/decade and ION/IOFF ratio of 8.1 × 104 with low hysteresis (30 mV) at drain voltage (VD) of 0.1 V. © 2021 IEEE.

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https://www.scopus.com/inward/record.uri?eid=2-s2.0-85108156494&doi=10.1109%2fVLSI-TSA51926.2021.9440120&partnerID=40&md5=62dd924c30f72cc74c167b39839222c3檢視

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