摘要
Warpage can be further amplified during subsequent manufacturing processes, such as surface mount technology and flip-chip assembly, due to repeated thermal cycling and process-induced temperature histories. This deformation may result in defects including empty or weak solder joints, which directly degrade assembly yield and long-term reliability. Therefore, effective control and evaluation of substrate warpage are essential to ensure mechanical stability and manufacturing robustness. This study emphasizes the importance of warpage management in advanced semiconductor packaging and highlights its impact on product performance and reliability. © 2026 Japan Institute of Electronics Packaging.