Abstract
Optical Microelectromechanical systems (MEMS) have recently emerged as a powerful means of implementing such functions in compact and low-cost form, owing to the unique capability of this technology to integrate optical, mechanical, and electrical components on a single wafer. Various optical MEMS components, such as laser printer, display, and optical cross connects, have been demonstrated. However, how to used planar fabrication for commercialized optical MEMS device is one of key challenges. This work integrated two-poly MUMP’s process, multi-depth DRIE etching and bulk micromachining to accomplish superior poly-Si micro-optical systems. The thickness and depth-difference of the devices was significantly increased using the trench-refilled structure. In addition, the space between the devices and the substrate was remarkably increased to ~100µm by bulk silicon etching. Moreover, the self-aligned vertical comb actuators were available through the multi-depth DRIE etching for high performance out-pf-plane actuator. In applications, he scanning mirrors driven by self-aligned vertical comb actuator were demonstrated. These multi-depth optical devices can further integrate with the MUMP’s devices to establish a more powerful MOEMS platform.