Abstract
Bulk Film bulk acoustic devices have the advantages of low loss, high power duriability, and high compatibility with integrated circuits. This study will improve the performance of the bulk acoustic devices using MEMS technology, moreover, this study also analyzes the requirement of film bulk acoustic devices and build acoustic models in commercial microwave software ADS. Resonators are designed by this model to meet required specifications. This study has developed a dry etching process to fabricate the resonator. The measured quality factor of this resonator is over 1000. Filters and its miniaturized packaging method are studied and verified. Moreover, this research also investigates on integration of bulk acoustic resonators with passive elements, such as inductors, capacitors, and Bi-CMOS MEMS varactors. In summary, this thesis not only improves the fabrication and packaging process of FBAR devices, but also provides a verified design plateform. This developed model and systematic design methodlogy are the foundation for future bulk acoustic devices.