Abstract
The two polysilicon MEMS fabrication platform MOSBE is base on the popular polysilicon thin-film fabrication technology. MOSBE integrated bulk micromachining, self-aligned, trench-refill, front-side etching. This process provides the designer on the thickness of the structure and vertical depth changes to complete the three-dimensional structure. Presently MOSBE has successfully developed a number of optical devices that using in optical components can be confirmed. Micro sensors are very important devices in MEMS. Consumer electronics products detection and acquisition by the environment signal, thus the micro-sensors can be integrated to achieve real-time human-machine interface. Capacitive sensing device have many advantages, however resulting from the displacement of the electrode plate capacitance change, environmental signals can be detected. Capacitive micro sensors detected environmental signals by the displacement of the electrode plate and then capacitance change. In this study, the micro capacitance devices have successfully developed with MOSBE platform. Two capacitance sensing method has been proved by MOSBE platform. It does conform to micro capacitance device performance. First, the rigid diaphragm microphone sensing signals method by out-of-plane gap-closing. Second, the 2-axis accelerometer sensing method by in plane area change. Final, the 3-axis accelerometer sensing method by in plane gap closing (x-axis and y-axis) and out-of-plane gap closing (z-axis). Therefore, the MOSBE fabrication platform has successfully developed with the capacitance devices.