2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008: Welcome message from K. N. Chiang, Conference co-chair

Editorial

2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008, p.4

2008

Abstract

Hardware and Architecture

Control and Systems Engineering

Electrical and Electronic Engineering

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Title: 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008: Welcome message from K. N. Chiang, Conference co-chair
Translated title: 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008: Welcome message from K. N. Chiang, Conference co-chair
Creators - without role: K.N. Chiang - IMAPS-Taiwan , National Tsing Hua University
Publication Details: 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008, p.4
Identifiers: 9781424436248; 9957770421206774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: English
Resource Type: Editorial