F5: Enabling New System Architectures with 2.5D, 3D, and Chiplets

Editorial

Open access

Christopher Gonzalez, Huichu Liu, Mijung Noh, Eric Karl, Thomas Toifl and Shawn Hsu

Digest of Technical Papers - IEEE International Solid-State Circuits Conference, Vol.64, pp.529-532

02/2021

Abstract

Electronic

Optical and Magnetic Materials

Electrical and Electronic Engineering

url

https://doi.org/10.1109/ISSCC42613.2021.9365834View

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Title: F5: Enabling New System Architectures with 2.5D, 3D, and Chiplets
Translated title: F5: Enabling New System Architectures with 2.5D, 3D, and Chiplets
Creators - without role: Christopher Gonzalez - Ibm
Huichu Liu - Menlo School
Mijung Noh - Samsung (South Korea)
Eric Karl - Intel (United States)
Thomas Toifl - Ecosens (Switzerland)
Shawn Hsu - National Tsing Hua Univeristy
Publication Details: Digest of Technical Papers - IEEE International Solid-State Circuits Conference, Vol.64, pp.529-532
Identifiers: 9781728195490; 9957767027706774
Academic Unit: College of Electrical Engineering and Computer Science, National Tsing Hua University
Language: English
Resource Type: Editorial