- Title
- Foreword: Pb-free solders and emerging interconnect and packaging technologies
- Creators - without role
- Kwang-Lung Lin - National Cheng Kung UniversitySung K. Kang - IBM T.J. Watson Research CenterJenq-Gong Duh - National Tsing-Hua UniversityAndre Lee - Michigan State UniversityThomas Bieler - Michigan State UniversityLaura Turbini - Research in MotionRajen Sidhu - Intel CorporationFu Guo - Beijing University of TechnologyIver Anderson - Iowa State University
- Publication Details
- Journal of Electronic Materials, Vol.39(12), p.2503
- Identifiers
- 9957768564606774
- Academic Unit
- National Tsing Hua University
- Language
- English
- Resource Type
- Editorial
Editorial
Foreword: Pb-free solders and emerging interconnect and packaging technologies
Journal of Electronic Materials, Vol.39(12), p.2503
12/2010
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