Introduction to the Special Issue on the 2020 IEEE International Solid-State Circuits Conference (ISSCC)

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Friedel Gerfers, Ping-Hsuan Hsieh, Dejan Markovc, Jun Deguchi 和 Eric Karl

IEEE Journal of Solid-State Circuits, 卷.56(1), 頁碼.3-6

01/2021

摘要

Electrical and Electronic Engineering

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https://doi.org/10.1109/JSSC.2020.3037445檢視

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題名: Introduction to the Special Issue on the 2020 IEEE International Solid-State Circuits Conference (ISSCC)
翻譯題名: Introduction to the Special Issue on the 2020 IEEE International Solid-State Circuits Conference (ISSCC)
創作者：: Friedel Gerfers (作者) - Technische Universität Berlin
Ping-Hsuan Hsieh (作者) - National Tsing Hua University
Dejan Markovc (作者) - University of California, Los Angeles
Jun Deguchi (作者) - Kioxia Corporation
Eric Karl (作者) - Intel (United States)
學術資源類型: 社論
出版日期: 01/2021
出版資訊: IEEE Journal of Solid-State Circuits, 卷.56(1), 頁碼.3-6
語言: 英語