Welcome Message from Conference Honorary Chair Kuo-Ning Chiang

Editorial

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, Vol.2017-October, p.5

01/2018

Abstract

Hardware and Architecture

Control and Systems Engineering

Electrical and Electronic Engineering

1 Record Views

Title: Welcome Message from Conference Honorary Chair Kuo-Ning Chiang
Translated title: Welcome Message from Conference Honorary Chair Kuo-Ning Chiang
Creators - without role: Kuo-Ning Chiang - National Tsing Hua University
Identifiers: 9781538647196; 9957773335206774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: English
Resource Type: Editorial
Publication Details: Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, Vol.2017-October, p.5