Welcome Message from Kuo-Ning Chiang, Conference Honorary Chair

Editorial

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, Vol.2021-December, p.5

2021

Abstract

Hardware and Architecture

Control and Systems Engineering

Electrical and Electronic Engineering

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Title: Welcome Message from Kuo-Ning Chiang, Conference Honorary Chair
Translated title: Welcome Message from Kuo-Ning Chiang, Conference Honorary Chair
Creators - without role: K.N. Chiang - Academician , International Academy of Engineering (IAE)
Publication Details: Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, Vol.2021-December, p.5
Identifiers: 9781665431910; 9957769966606774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: English
Resource Type: Editorial