Welcome message from K. N. Chiang

Editorial

2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, p.4

2008

Abstract

Hardware and Architecture

Electrical and Electronic Engineering

Mechanical Engineering

1 Record Views

Title: Welcome message from K. N. Chiang
Translated title: Welcome message from K. N. Chiang
Creators - without role: K.N. Chiang - National Tsing Hua University
Publication Details: 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, p.4
Identifiers: 9781424436217; 9957776812806774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: English
Resource Type: Editorial