Welcome message from Ku-Ning Chiang, conference Co-chair

Editorial

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, p.4

2011

Abstract

Hardware and Architecture

Control and Systems Engineering

Electrical and Electronic Engineering

1 Record Views

Title: Welcome message from Ku-Ning Chiang, conference Co-chair
Translated title: Welcome message from Ku-Ning Chiang, conference Co-chair
Creators - without role: Ku-Ning Chiang - National Center of High-Performance Computing
Publication Details: Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, p.4
Identifiers: 9781457713880; 9957777384306774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: English
Resource Type: Editorial