Welcome message from Kuo-Ning Chiang, conference honorary chair

Editorial

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, Vol.2018-October, p.5

01/2019

Abstract

Hardware and Architecture

Control and Systems Engineering

Electrical and Electronic Engineering

1 Record Views

Title: Welcome message from Kuo-Ning Chiang, conference honorary chair
Translated title: Welcome message from Kuo-Ning Chiang, conference honorary chair
Creators - without role: Kuo-Ning Chiang - National Tsing Hua University
Publication Details: Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, Vol.2018-October, p.5
Identifiers: 9781538656150; 9957773888306774
Academic Unit: Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
Language: English
Resource Type: Editorial