Abstract
We propose a platform-based approach for 3D IC implementation of complex electronics systems. We emphasize Manufacturing Reuse to lower the overall cost of implementing and mass-producing 3D chips for multiple applications. Given a set of applications, each employs a set of IPs and needs a certain amount of mass-production volume, our objective is to design a 3D IC architecture such that the total design-plus-manufacture cost is minimized for all applications. We achieve this by defining certain platform-dies that can be prefabricated-and-reused across multiple applications. Our target 3D IC stack consists of platform dies and customized dies. Platform dies can be manufactured in huge volume at very low unit cost and used in many applications. Customized dies for individual application, on the other hand, will be smaller and easier to implement, as most functionality has been allocated to the platform dies. We have developed a 3D IC cost model for our platform generator to evaluate platform-layer configurations. Based on simulated-annealing optimization, this generator finds a platform that minimizes the overall cost of a set of applications. Experimental results indicate that Chipsburger is cost-effective for a wide range of volume requirements.