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A Leadframe Minimization Method for System-In-Package
Thesis

A Leadframe Minimization Method for System-In-Package

Shin-Chuan Lai
Masters, 國立清華大學, 資訊工程學系
2004

Abstract

導線架 leadframe
A special kind of wire connection is used for the System-in-Package (SIP). There is a close relation between the wire connection and leadframe. The locations of pads of nets are fixed, and the changes of the die rotation and layer location affect the connection of wires. Without connecting directly, leadframe is used to connect wires. We propose an algorithm to minimize the routing layers on leadframe. A fast heuristic algorithm was developed to find the approximate solution. Experimental results on a set of benchmark are reported to demonstrate the effectiveness of the proposed method. Also, we propose a heuristic method to shorten the computation time.

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