Abstract
Fan-out Wafer Level Packaging (FOWLP), which performs the packaging of dies while still being part of the wafer, has attracted a lot of attention for advanced electronic products in recent years. However, in FOWLP, there is a mechanical problem, the die shift problem which can cause a die to be shifted away from its original position on the carrier for FOWLP. The die shift problem can lead to the misalignment of contacts and therefore cause failure of dies. It has been shown by several researches that the majority of dies are shifted away from the center. Taking into account this shifting trend, in this paper, we propose an alleviation methodology integrating two novel approaches to alleviate the die shift problem. The experiments show that the die shift of 12- and 18-inch FOWLP can be alleviated and the yield will be highly improved.