Abstract
We propose a platform-based three-dimensional integrated circuit (3D IC) design methodology called Chipsburger. 3D ICs promise many advantages over traditional system-on-a-chip (SoC). Most 3D IC studies address design challenges such as thermal, performance, and floorplanning. Less attention has been paid to cost-driven design. Chipsburger design methodology takes into account both manufacturing cost and design effort. To evaluate our proposed methodology, we implement a H.264/AVC video decoder in Chipsburger 3D IC. Experiments confirm that Chipsburger can reduce non-recurring engineering (NRE) and manufacturing cost, enhance performance, improve energy efficiency, and reduce complexity.