Abstract
This thesis presents an any-bond test method for TSV, and any-bond test means that including pre-bond, mid-bond, and post-bond test. We repeatedly use the same set of design-for-testability circuits to achieve our test method. In our test architecture, all the test wrappers are cascaded one after another to form a global ring oscillator, and we use daisy-chain and test access protocol controller to support our test method. By doing so, the test-result retrieval problem in previous local-ring based method can be alleviated. Even though our method can’t achieve the 100% fault location coverage for overall TSV in the pre-bond stage, we can do that in post-bond stage.