Abstract
In semiconductor manufacturing industry, the manufacturing process of wafer is complex and change rapidly. For ensuring high quality product low defect rate, inspection is one of most important manufacturing processes. After developing inspection (ADI) and after etching inspection (AEI) are the main inspection tasks in FAB. ADI and AEI are carried out on microscopes. Operators being responsible for ADI or AEI complain of visual fatigue problems. According to preliminary survey results, we found that display mode, visual search strategy and work pace (resting and working) are main factors affecting visual fatigue. A 3 factors factorial experiment was designed. Display modes included microscope inspection and LCD inspection. Visual search strategies included S type search pattern and clockwise search pattern. Work pace included the third, fourth, fifth inspection points inspect 4 or 6 dies. Dependent variables included: critical fusion flicker (CFF), near point accommodation (NPA), visual acuity and contrast sensitivity. In addition, inspection performance such as average inspect time per wafer, defect wafer number, defects finding in 8 POD and defect find per second were measured. The results indicate that display modes had significantly influences in reducing visual fatigue. In inspection performance, microscope inspection was better than LCD inspection.