Abstract
A space sensor often consists of a number of dies integrated in a side-by-side manner on a single packaging substrate due to its high-resolution requirement. The alignment of these dies, i.e., placement of the dies so that their respective sensor cells can align horizontally, is highly challenging. Even with high-precision instruments, die-to-die misalignment may still exist. To overcome this problem, we investigate in this thesis a Built-In Self-Repair scheme. We first decide how big the misalignment is for each die-to-die boundary using the concept of cross-correlation. Once the misalignment size is decided, the information is used to repair the distorted image by simply modifying the addressing of the image buffer. Simulation indicates that the misalignment can be repaired nicely for hundreds of test images with almost 100% successful rate. The proposed BISR scheme can be built as a simple collar circuit around the image buffer. The layout shows only 3.29% area overhead for a VGA-resolution test circuit.