Abstract
In this thesis, we propose a built in self repair (BISR) method that can automatically repair the large propagation delays across the Through Silicon Vias (TSVs) in a 3D IC. We adopt the concept of the oscillation ring (OR) test, in which two TSVs are connected with some peripheral circuits to form an oscillation ring. Based on this foundation, we propose a technique called Variable Output Threshold (VOT) to further derive the propagation delay of each individual TSV in the oscillation ring. In this process, we use the Variable Threshold (VT) inverter that combine a normal inverter and a Schmitt Trigger (ST) inverter, and then measure their effects in terms of the change of the oscillation ring’s period. By some following analysis, the propagation delay of each TSV can be revealed. We also construct a BISR circuit for block array to repair weakly TSVs that have large delay.