Abstract
Nowadays, mature CMOS standard process is not restricted itself in IC fabrication but steadily integrates MEMS on a monolithic single chip called CMOS MEMS. IC and MEMS fabricated under CMOS process could eliminate processing steps and their complexity. The merit of monolithic integration reveals SoC achievability. Most developing or production MEMS devices fabricated under CMOS process are integrating sensors and ICs. Nevertheless, integration of micro transducers including actuator, sensor and IC will make system multi-function and precision controllability. This study demonstrates an integration of actuating and sensing mechanism which consisted of one plate structure, two thermal actuators, and two piezoresistive sensors. Thus, the mechanism of the plate is sensed and controlled by the sensors and actuators, respectively. This micromachined mechanism was realized using a standard UMC 0.5 µm 2 poly and 2 metal CMOS process. After conventional CMOS process, post CMOS process is necessary to release MEMS device, which adopts RIE treatment and TMAH wet etching. By external measurement, we have characterized the device’s performances by static operation, dynamic performance, and actuating temperature distribution under steady state. This study proposes a complete design flow for similar CMOS MEMS applications including simulation, post CMOS process, and measured results.