Abstract
In strongly competitive environment, DRAM industry which self sufficiently produces and sells products also needs continuous new product development, cost reduction via quality improvement, and cycle time reduction in order to enhance the competitiveness of enterprise. As semiconductor industry is involved with complicated processes, new product development in the early phase should not only be addressed the introduction and development of technology but also the details of management and quality plan. All possible root causes of quality issues shall be eliminated prior to mass production in order to meet customers’ requirements.This thesis is a case study that, taking CMOS image sensor as example, utilizes Quality Function Deployment (QFD) to establish critical technology requirements that meet customer’s demands and technology demands through expertise survey and interview on quality check items. The relationship between critical technology demands and process demands can therefore be allocated by QFD matrix via the integration of Failure Mode and Effects Analysis (FMEA) so that failure mode analysis can be set up to explore the failure root causes towards prevention. Quality planning process for new product development is accordingly established to reduce corporate’s research and development cost and new product development cycle time to reach the realm of source management - “Quality is embedded in prevention instead of inspection”.